64 Besuche |
0 Bewerbungen |
Beschreibung:
Within the development of new processes in the Backend Semiconductor, a great deal amount of information is derived using images which are generated by measurement tools. These include X-Ray images, Scanning Electron Microscopy (SEM) images, Scanning Acoustic Tomography (SAT) images and Optical images. As of today, quantitative analysis on the images is predominantly done manually with some help of image processing software. This may take considerable amount of time, given the number of images. AI models which can classify the images for certain defect/criteria and give a quantitative measurement of such issue will be able to provide both tangible and intangible values for (COMPANY NAME).
Students will get to design this module with challenging state of the art machine languages and Machine/Deep Learning Algorithms.
* Automation in processing batch of images
* Classification (qualitative) of defect of interest in the batch of images
* Object detection and feature extraction
* AI models to derive the quantitative analysis of the given defect of interest
* Automation of the reporting and possible connectivity with SPC software to close the loop
Ihr Profil:
You are best equipped for this task if you have:
* Singaporean Citizen or Permanent Resident at the time of application
* Be eligible for full-time MbR studies
* Have an interest in AI image processing
* Knowledge in Backend semiconductor (packaging) processes (e.g. Molding, Wire Bonding, Die Bonding, etc)
Quelle: | Website des Unternehmens |
Datum: | 25 Sep 2024 |
Stellenangebote: | Graduate Programme |
Bereich: | Fernmeldewesen |
Sprachkenntnisse: | Englisch |