Industrial Postgraduate Programme (IPP) PhD Thesis - Artificial Intelligence application on Backend Semiconductor's Process Development

Beschreibung:

Backend Process Development has been the core to enable new packaging solutions to address new requirements from (COMPANY NAME)'s customers. Depending on the complexity of the projects, this may take significant amount of the project time, thus adding the lead time needed for the new package to be released to the market. Combining the data from process machines, where real-time data are collected during the fabrication of the units, with input parameters of the chips and Bill Of Materials (BOM), as well as the output measurements, an AI model could be developed for future process development with similar configuration. The model should provide prediction on output responses given a set of input parameters, which may substitute the early stage of process development such as feasibility of Proof of Concept (POC) and Design Of Experiments (DOE).
In your new role you will:

* To do current market research on the AI application for unit process development in Backend Semiconductor, listing out the benefits as well as risk involve.
* To work closely with the unit process engineers (UPD), in understanding the machine data that will be used in the AI model, output responses that are key measurement in ensuring quality packaging.
* To develop a POC of a possible AI model based on 1 or more unit processes

Ihr Profil:

You are best equipped for this task if you have:

* Singaporean Citizen or Permanent Resident at the time of application
* Be eligible for full-time PhD studies
* Have an interest in AI modelling of complex system give the amount of machine data.
* Knowledge in Backend semiconductor (packaging) processes (e.g. Molding, Wire Bonding, Die Bonding, etc)