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Detalles de la Oferta
Detalles de la Oferta

Package Roadmap Tool Intern - Package Innovation

NXP Semiconductors
Malasia  Kuala Lumpur, Malasia
Prácticas, Informática/Tecnología, Inglés
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Descripción del puesto:

Package Roadmap Tool Intern - Package Innovation

Role Summary
Develop and enhance tools to enable structured definition, visualization, and management of package technology roadmaps across platforms.

Key Responsibilities
* Design and implement a Package Roadmap Tool to track technology evolution, capabilities, and platform alignment
* Participate and support Platform Manager lead to integrate inputs from business lines, competitive analysis, and supplier data into a centralized roadmap framework
* Improve data structure, usability, and automation of roadmap tracking (e.g., dashboards, visualizations)
* Participate and support Platform Manager lead for roadmap reviews and ensure alignment with PI strategy, cost targets, and technology readiness
* Collaborate cross-functionally with platform, API, and manufacturing teams

Additional Exposure
* Participate in ATKL manufacturing projects to build foundational knowledge of package assembly and process flows

Qualifications
* Degree candidate in Computer Science (preferred), Engineering, or related field
* Strong programming and data structuring skills (e.g., Python, data tools, automation frameworks)
* Experience with Excel, Power BI, or similar tools for visualization and tool development
* Ability to translate technical inputs into structured, scalable frameworks
* Self-driven with strong collaboration and communication skills

More information about NXP in Malaysia...
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Origen: Web de la compañía
Publicado: 24 Sep 2026 (comprobado el 07 Oct 2026)
Tipo de oferta: Prácticas
Idiomas: Inglés
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