“AMD offers a 6-month onsite internship in Cork or Dublin for Analog & Mixed-Signal Design, starting Jan 15 or Jun 1. Work with SerDes team on high-speed IC design, simulations, and layout using industry tools. Ideal for EE/ME students with analog/mixed-signal interest.”
AMD | Estados Unidos
|Prácticas, Ingeniería, Inglés
“AMD offers a 3-month onsite internship (May-Aug/Sep 2027) in Santa Clara, CA for a master's student in electrical/optical engineering. Work involves high-speed SerDes, optical interconnects, and AI hardware validation with Python/MATLAB. No visa sponsorship.”
“AMD offers a 7-month Thermal Engineering internship (Jan-Aug or May-Dec 2027) in Santa Clara, CA. Hybrid/onsite role for Master's students in mechanical/aerospace engineering, focusing on AI cooling tech, liquid/air cooling systems, thermal modeling, and lab testing. Requires CAD/CFD tools and heat transfer knowledge. No visa sponsorship.”
“AMD offers a 14-month onsite Engineering Placement Internship in Belfast starting July 2027. Focuses on hardware/software development, ASIC/FPGA design, and embedded systems. Requires UK-based engineering student with skills in C/C++, Python, Verilog/VHDL, and AMD toolchains. Includes mentorship, networking, and hands-on project experience.”
AMD | Estados Unidos
|Prácticas, Ingeniería, Inglés
“AMD offers a 7-month Thermal Engineering internship/co-op in Santa Clara, CA, for undergrads in mechanical/aerospace engineering. Role involves thermal management, liquid cooling, lab testing, and CFD tools. Hybrid/onsite/remote options available. No visa sponsorship.”
“AMD offers a 3-month summer 2027 internship in Edinburgh, UK, for Hardware Engineers. Hybrid role requiring full-time onsite/hybrid work from June 1, 2027. Focus on digital design, RTL coding, FPGAs, and simulation tools. Open to UK-based EE/CE students with relevant skills.”
“AMD offers a 3-month hybrid internship in Edinburgh starting June 2027 for Computer Science/Engineering students. Role involves C++/Python, Linux/Windows, Verilog/VHDL, and FPGA/ACAP work. Competitive benefits and inclusive hiring process.”
“AMD offers a 7-month internship/co-op starting in January 2027 for undergrads in engineering or related fields. Hybrid/onsite in Austin, TX, focusing on program management, AI, and data analysis. Competitive internship with benefits, no visa sponsorship.”
“AMD offers a 3-month summer internship (May-Aug or Jun-Sep 2027) in San Jose, CA for a Masters-level Digital Signal Processing Engineer. Focus on RF modeling, adaptive algorithms, and ML for 5G/6G applications. Requires coursework in DSP, ML, and wireless comms. Full-time onsite role.”
“AMD offers a 6-month (Jan-Jun 2027) internship in China for master's students, focusing on AI, chip design, and hardware. Hybrid/onsite roles available in Shanghai, Beijing, or Shenzhen. Apply by Nov 13, 2026.”
AMD | Estados Unidos
|Prácticas, Investigación, Inglés
“AMD offers a Summer 2027 PhD Technical Program Manager internship in Santa Clara, CA, focused on AI research. The role involves supporting research roadmaps, coordinating datasets, and tracking experiment performance. Requires a PhD in a technical field, ML knowledge, and project coordination experience. Hybrid/onsite, 40 hours/week.”
AMD | Estados Unidos
|Prácticas, Investigación, Inglés
“AMD offers a 3-month summer 2027 internship in Santa Clara, CA for PhD students in AI/ML. Focus on generative AI, reinforcement learning, and post-training LLM methods. Requires Python/PyTorch skills and relevant publications preferred. Hybrid/onsite role.”
“AMD offers a 4 or 8-month onsite internship in Markham, Canada (Jan-Apr, May-Aug, Sep-Dec 2027) for technical marketing/performance analysis. Focus on testing and analyzing 3D graphics performance, driver releases, and competitor products. Requires CS/CE degree or related, strong graphics knowledge, and scripting skills (C++, Python). Full-time role with benefits.”
“AMD offers a 6-month Supply Chain Co-Op/Internship in Austin, TX (hybrid/onsite) starting Jan 2027 or May/June 2027. Ideal for undergrads in Industrial Engineering, Supply Chain, or related fields. Work on capacity planning, logistics, and data analysis with potential for full-time roles. No visa sponsorship.”
“AMD offers a 5-month internship in Singapore (Jan 2027–May 2027, extendable to Aug 2027) for PhD students in EE/Photonics/Optics. Focus on developing optical characterization methods for advanced packaging technologies, including hands-on lab work, data analysis, and automation scripting. Benefits included.”
“AMD offers a Fall 2027 Silicon Design Engineering Internship in Austin, TX (onsite, 40h/week). Role involves new product bring-up, debugging, firmware development, and automation/testing. Seeks graduate students in Electrical/Computer Engineering with high-speed I/O design experience, Python/Perl, and lab equipment familiarity. Visa sponsorship not eligible.”
“AMD offers a 12-16 month ASIC Verification Engineering internship/co-op in Ottawa, Canada, starting May 2027. Role involves developing verification environments for next-gen communication networks and data centers using SystemVerilog-UVM, C++, and Python. Hybrid/onsite work required. Ideal for 3rd/4th year Computer Engineering or Computer Science students with digital design and OOP knowledge.”
“AMD offers a 12-month internship/co-op in Markham, Ontario, for diagnostics design engineering. Role involves C++ programming, Linux debugging, and hardware validation for processors. Open to Canadian university students in Electrical/Computer Engineering with relevant skills.”
“AMD offers a 12-month Hardware Design Verification Engineering internship (May 2027-Apr 2028) in Markham, Canada. Hybrid/onsite role requiring full-time work (37.5 hrs/week) for students in Electrical/Computer Engineering or related fields. Focus on AI hardware testing, Verilog/SystemVerilog, Python/Perl scripting, and system-level validation. Benefits included.”
“AMD offers a 2027 Masters Compiler Engineering Internship/Co-op in Austin, TX, Boxborough, MA, or other US locations. Hybrid/onsite role for 40h/week, focusing on compiler development for P4 language using LLVM/P4C. Open to Master's students in CS/CE/EE with C++ and compiler experience. No visa sponsorship.”
“AMD offers a 4 or 8-month Graphics Software Engineering Intern/Co-Op in Markham, Canada, starting Jan/May/Sept 2027. Hybrid/onsite role for full-time 37.5 hrs/week. Requires C/C++, graphics pipelines, and computer science background. Interns collaborate on projects like AMD FidelityFX Super Resolution and Ryzen/Radeon Graphics chips.”
“AMD offers a 12-month Firmware Engineering internship (May 2027-Apr 2028) in Vancouver, Canada. Hybrid/onsite role for students in Electrical/Computer Engineering or related fields, focusing on C/C++ firmware development, debugging, and hardware integration. Includes training, mentorship, and participation in design reviews.”
“AMD offers a 4 or 8-month Firmware Engineering internship/co-op in Markham, Canada, starting January, May, or September 2027. Hybrid/onsite role for full-time work (37.5 hrs/week) in C/C++ firmware development, embedded systems, and hardware debugging. Open to Canadian university students in related fields.”
“AMD offers a Hardware Design Verification Engineering internship in Vancouver, Canada, for 4 or 8 months starting in Jan, May, or Sep 2027. The role involves testing AMD's AI products, scripting in Perl/Python, and collaborating with senior engineers. Requires enrollment in a Canadian university in EE/CS/CE or related fields.”
“AMD offers a Machine Learning/AI internship in Markham, Canada, for 4 or 8 months starting in Jan, May, or Sep 2027. Hybrid/onsite role for students in Computer Science/Engineering with Python, C++, ML frameworks, and cloud experience. Work on AI product development and user experience improvements.”
“AMD offers a 7-month (Jan-Aug or May-Dec 2027) internship/co-op in San Jose or Santa Clara, CA, for undergrads in CS/CE/EE. Work on a P4 compiler using LLVM/P4C, collaborate with ASIC teams, and receive mentorship. Hybrid/onsite, no visa sponsorship. Ideal for C++ and compiler enthusiasts.”
“AMD offers a 12-month Software Test Engineering internship (May 2027–Apr 2028) in Markham, Ontario. Hybrid/onsite role for full-time work (37.5 hrs/week). Focus on automated/manual testing, defect triaging, and QA process improvement for dGPU/APU products and OS (Linux/Windows). Requires CS/CE/ECE background with Python/C++/Selenium skills. Benefits included.”
“AMD offers a 4 or 8-month internship/co-op in Program Management starting Jan, May, or Sep 2027 in Markham, Canada. Hybrid/onsite role for full-time work (37.5 hrs/week) in AI ecosystem. Requires enrollment in a Canadian university (Computer Science/Engineering focus). Technical skills in MS Office, PowerBI, SQL, Python, and project management preferred. Benefits included.”
“12-month internship/co-op in Markham, Canada for Analog & Mixed-Signal Engineering students. Work on advanced semiconductor technologies, EDA tools, and automation with AMD engineers. Hybrid/onsite role starting May 2027. Requires EE/CE background and scripting skills.”
“12-16 month paid internship/co-op at AMD in Markham, Ontario, for graphics software engineering. Requires C/C++, graphics pipelines, and OS knowledge. Hybrid/onsite role from May 2027 to Aug 2028. Focus on high-performance computing and AI development.”
“AMD offers a Software Engineering internship/co-op in Markham, Canada, for 4 or 8 months starting in Jan, May, or Sep 2027. Hybrid/onsite role for full-time work in software development, testing, and debugging with training provided. Requires enrollment in a Canadian university in Computer Science or related field.”
“AMD offers a 12-month Hardware Design Engineering Internship/Co-Op in Vancouver, Canada, starting May 2027. Focus on ASIC design, RTL, UVM, and physical verification for AI products. Requires enrollment in a Canadian Electrical/Computer Engineering program. Hybrid/onsite role.”
“AMD offers a 12-16 month Machine Learning/AI internship in Markham, Canada (hybrid/onsite). Focus on ML/AI R&D, Python/C++ programming, and frameworks like PyTorch/TensorFlow. Open to 3rd/4th year Canadian university students in CS/Engineering. Benefits included.”
“AMD offers a 12-month Software Engineering internship (May 2027–Apr 2028) in Calgary, Canada. Hybrid/onsite role for full-time work, focusing on software development, debugging, and cloud platforms. Open to Canadian university students in relevant fields.”
“AMD offers a 12-month hybrid/onsite Program Management internship (May 2027–Apr 2028) in Markham, Ontario. Ideal for Canadian CS/Engineering students with project management, Excel, PowerBI, and Python skills. Involves schedule planning, risk management, and data visualization for AI/tech projects.”
“AMD offers a 12-month Product Management internship/co-op in Calgary, Canada (hybrid/onsite). Ideal for Canadian CS/SE students with open-source, AI, and hardware knowledge. Work on GPU software roadmaps, market research, and technical projects impacting millions. Benefits included.”
“AMD offers a Data Analyst internship/co-op in Markham, Canada, for 4 or 8 months starting in Jan, May, or Sep 2027. Hybrid/onsite role requiring Python, SQL, R, data visualization tools, and cloud services. Open to Canadian undergraduates in data-related fields.”
“AMD offers a Hardware Design Engineering internship/co-op in Markham, Canada, for 4-8 months starting Jan, May, or Sep 2027. Work on ASIC design, RTL, Verilog, UVM, and chip interconnects. Requires enrollment in a Canadian EE/CE Bachelor's program. Hybrid/onsite role.”
“AMD offers a 7-month Software Test Engineering internship/co-op (Jan-Aug or May-Dec 2027) in San Jose or Santa Clara, CA. Hybrid/onsite role for undergrads in CS/CE/EE with QA, testing, and scripting skills. Gain hands-on experience in automated/manual testing, defect triaging, and collaboration with development teams.”
AMD | Fort Collins
|Prácticas, Informática, Inglés
“AMD offers a 7-month Software Test Engineering internship/co-op starting in Jan 2027 or May/June 2027. Hybrid/onsite roles in Austin, TX or Boxborough, MA, with tasks including test planning, defect triaging, and automation. Requires MS in CS/CE/Electrical Engineering, programming skills (Python, C++), and Linux/Windows experience. No visa sponsorship.”
“AMD offers a 6-month ASIC Package Engineering internship (Jan-Aug 2027) in Austin, TX or Boxborough, MA. Hybrid/onsite role for undergrads in EE/related fields, focusing on package design, yield analysis, and material benchmarking. No visa sponsorship.”
“AMD offers a 5-month internship in Singapore for AI-driven BOM automation using LLMs, RAG, and AI agents. Candidates must be Singapore-based students with Python/SQL skills. Project involves developing AI solutions for semiconductor product data management with cross-functional teams.”
“AMD offers a 5-month internship in Singapore (Jan-May 2027, optional extension to Aug 2027) for AI-intrinsic CPU/GPU product development. Focus on AI/ML models, MLOps, and full-stack solutions. Open to Singapore-based university students in CS, AI, or related fields. Basic Python/SQL required; advanced skills in CI/CD, Kubernetes, and LLM frameworks are a plus.”
“AMD offers a 7-month ASIC Package Engineering internship (Jan-Aug 2027 or May-Dec 2027) in hybrid/onsite roles at Austin, TX, Boxborough, MA, or other US locations. Candidates must be US-based Masters students in EE/CE/ME/MS/related fields with skills in PCB design, scripting (Python/Perl), and semiconductor packaging. Visa sponsorship not available.”
“AMD offers a 7-month Product Development Engineering internship (Jan-Aug 2027 or May-Dec 2027) in hybrid/onsite roles across multiple US locations. Ideal for undergrad CS/EE students with skills in C++, Linux, scripting, and hardware debugging. Involves yield analysis, test program development, and product characterization for next-gen microprocessors.”
“AMD offers a 7-month (Jan-Aug or May-Dec 2027) Firmware Engineering internship/co-op in hybrid/onsite roles across multiple US locations. Ideal for Master's students in EE/CS/CE with C/C++ and embedded firmware experience. Work on x86 firmware, bootrom, and HW/FW debugging. No compensation details provided.”
“AMD offers a 7-month Firmware Engineering internship (Jan-Aug or May-Dec 2027) in hybrid/onsite roles across the US. Work on low-level C/C++ firmware development, embedded systems, and hardware debugging for AMD products. Ideal for US-based EE/CS/CE undergrads with relevant skills. Visa sponsorship not eligible.”
“AMD offers a 7-month Firmware Engineering internship (Jan-Aug or May-Dec 2027) in San Jose/Santa Clara, CA. Hybrid/onsite role for undergrads in EE/CS/CE. Work on x86 firmware, embedded systems, and hardware debugging with C/C++. No visa sponsorship.”
AMD | Fort Collins
|Prácticas, Informática, Inglés
“AMD offers a 7-month Hardware Design Verification Engineering internship/co-op starting Jan 2027 or May/Jun 2027 in multiple US locations. Hybrid/onsite role for students in EE/CE programs with skills in Verilog, SystemVerilog, Python, C++, and hardware debugging. No visa sponsorship.”
AMD | Fort Collins
|Prácticas, Informática, Inglés
“AMD offers a 7-month Software Engineer Internship/Co-op (Jan-Aug 2027 or May-Dec 2027) in hybrid/onsite roles across US locations. Ideal for undergrad CS/CE/EE students with C/C++, Python, Linux, and cloud/Azure skills. Gain hands-on experience in software development, debugging, and automation under expert mentorship.”
