“AMD offers a Data Analyst internship/co-op in Markham, Canada, for 4 or 8 months starting in Jan, May, or Sep 2027. Hybrid/onsite role requiring Python, SQL, R, data visualization tools, and cloud services. Open to Canadian undergraduates in data-related fields.”
“AMD offers a 12-16 month ASIC Verification Engineering internship/co-op in Ottawa, Canada, starting May 2027. Role involves developing verification environments for next-gen communication networks and data centers using SystemVerilog-UVM, C++, and Python. Hybrid/onsite work required. Ideal for 3rd/4th year Computer Engineering or Computer Science students with digital design and OOP knowledge.”
“AMD offers a Fall 2027 Silicon Design Engineering Internship in Austin, TX (onsite, 40h/week). Role involves new product bring-up, debugging, firmware development, and automation/testing. Seeks graduate students in Electrical/Computer Engineering with high-speed I/O design experience, Python/Perl, and lab equipment familiarity. Visa sponsorship not eligible.”
“AMD offers a Fall 2027 Silicon Design Internship in Austin, TX (onsite, 40h/week). Ideal for graduate students in Electrical/Computer Engineering with high-speed I/O, Python/Perl, and lab experience. Role involves product bring-up, debugging, and firmware development for AI/processor technologies.”
“AMD offers a 12-month internship/co-op in Markham, Ontario, for diagnostics design engineering. Role involves C++ programming, Linux debugging, and hardware validation for processors. Open to Canadian university students in Electrical/Computer Engineering with relevant skills.”
“AMD offers a 12-month Hardware Design Verification Engineering internship (May 2027-Apr 2028) in Markham, Canada. Hybrid/onsite role requiring full-time work (37.5 hrs/week) for students in Electrical/Computer Engineering or related fields. Focus on AI hardware testing, Verilog/SystemVerilog, Python/Perl scripting, and system-level validation. Benefits included.”
“AMD offers a 2027 Masters Compiler Engineering Internship/Co-op in Austin, TX, Boxborough, MA, or other US locations. Hybrid/onsite role for 40h/week, focusing on compiler development for P4 language using LLVM/P4C. Open to Master's students in CS/CE/EE with C++ and compiler experience. No visa sponsorship.”
“AMD offers a 4 or 8-month Graphics Software Engineering Intern/Co-Op in Markham, Canada, starting Jan/May/Sept 2027. Hybrid/onsite role for full-time 37.5 hrs/week. Requires C/C++, graphics pipelines, and computer science background. Interns collaborate on projects like AMD FidelityFX Super Resolution and Ryzen/Radeon Graphics chips.”
“AMD offers a 12-month Firmware Engineering internship (May 2027-Apr 2028) in Vancouver, Canada. Hybrid/onsite role for students in Electrical/Computer Engineering or related fields, focusing on C/C++ firmware development, debugging, and hardware integration. Includes training, mentorship, and participation in design reviews.”
“AMD offers a 12-month Hardware Design Verification Engineering internship in Ottawa, Canada (hybrid/onsite). Candidates must be enrolled in a Canadian university's Bachelor's program in Electrical/Computer Engineering or related fields. Focus on CPU/APU verification, Verilog/SystemVerilog, Python/Perl scripting, and Linux/Unix development. Benefits included.”
“AMD offers a 4 or 8-month Firmware Engineering internship/co-op in Markham, Canada, starting January, May, or September 2027. Hybrid/onsite role for full-time work (37.5 hrs/week) in C/C++ firmware development, embedded systems, and hardware debugging. Open to Canadian university students in related fields.”
“AMD offers a Hardware Design Verification Engineering internship in Vancouver, Canada, for 4 or 8 months starting in Jan, May, or Sep 2027. The role involves testing AMD's AI products, scripting in Perl/Python, and collaborating with senior engineers. Requires enrollment in a Canadian university in EE/CS/CE or related fields.”
“AMD offers a Machine Learning/AI internship in Markham, Canada, for 4 or 8 months starting in Jan, May, or Sep 2027. Hybrid/onsite role for students in Computer Science/Engineering with Python, C++, ML frameworks, and cloud experience. Work on AI product development and user experience improvements.”
“AMD offers a 7-month (Jan-Aug or May-Dec 2027) internship/co-op in San Jose or Santa Clara, CA, for undergrads in CS/CE/EE. Work on a P4 compiler using LLVM/P4C, collaborate with ASIC teams, and receive mentorship. Hybrid/onsite, no visa sponsorship. Ideal for C++ and compiler enthusiasts.”
“AMD offers a 12-month Software Test Engineering internship (May 2027–Apr 2028) in Markham, Ontario. Hybrid/onsite role for full-time work (37.5 hrs/week). Focus on automated/manual testing, defect triaging, and QA process improvement for dGPU/APU products and OS (Linux/Windows). Requires CS/CE/ECE background with Python/C++/Selenium skills. Benefits included.”
“AMD offers a 4 or 8-month internship/co-op in Program Management starting Jan, May, or Sep 2027 in Markham, Canada. Hybrid/onsite role for full-time work (37.5 hrs/week) in AI ecosystem. Requires enrollment in a Canadian university (Computer Science/Engineering focus). Technical skills in MS Office, PowerBI, SQL, Python, and project management preferred. Benefits included.”
“12-month internship/co-op in Markham, Canada for Analog & Mixed-Signal Engineering students. Work on advanced semiconductor technologies, EDA tools, and automation with AMD engineers. Hybrid/onsite role starting May 2027. Requires EE/CE background and scripting skills.”
“12-16 month paid internship/co-op at AMD in Markham, Ontario, for graphics software engineering. Requires C/C++, graphics pipelines, and OS knowledge. Hybrid/onsite role from May 2027 to Aug 2028. Focus on high-performance computing and AI development.”
“AMD offers a Software Engineering internship/co-op in Markham, Canada, for 4 or 8 months starting in Jan, May, or Sep 2027. Hybrid/onsite role for full-time work in software development, testing, and debugging with training provided. Requires enrollment in a Canadian university in Computer Science or related field.”
“AMD offers a 12-month Hardware Design Engineering Internship/Co-Op in Vancouver, Canada, starting May 2027. Focus on ASIC design, RTL, UVM, and physical verification for AI products. Requires enrollment in a Canadian Electrical/Computer Engineering program. Hybrid/onsite role.”
“AMD offers a 12-16 month Machine Learning/AI internship in Markham, Canada (hybrid/onsite). Focus on ML/AI R&D, Python/C++ programming, and frameworks like PyTorch/TensorFlow. Open to 3rd/4th year Canadian university students in CS/Engineering. Benefits included.”
“AMD offers a 12-month Software Engineering internship (May 2027–Apr 2028) in Calgary, Canada. Hybrid/onsite role for full-time work, focusing on software development, debugging, and cloud platforms. Open to Canadian university students in relevant fields.”
“AMD offers a 12-month hybrid/onsite Program Management internship (May 2027–Apr 2028) in Markham, Ontario. Ideal for Canadian CS/Engineering students with project management, Excel, PowerBI, and Python skills. Involves schedule planning, risk management, and data visualization for AI/tech projects.”
“AMD offers a 12-month Product Management internship/co-op in Calgary, Canada (hybrid/onsite). Ideal for Canadian CS/SE students with open-source, AI, and hardware knowledge. Work on GPU software roadmaps, market research, and technical projects impacting millions. Benefits included.”
“AMD offers a Hardware Design Engineering internship/co-op in Markham, Canada, for 4-8 months starting Jan, May, or Sep 2027. Work on ASIC design, RTL, Verilog, UVM, and chip interconnects. Requires enrollment in a Canadian EE/CE Bachelor's program. Hybrid/onsite role.”
“AMD offers a 7-month Software Test Engineering internship/co-op (Jan-Aug or May-Dec 2027) in San Jose or Santa Clara, CA. Hybrid/onsite role for undergrads in CS/CE/EE with QA, testing, and scripting skills. Gain hands-on experience in automated/manual testing, defect triaging, and collaboration with development teams.”
“AMD offers a 7-month Software Test Engineering internship/co-op starting in Jan 2027 or May/June 2027. Hybrid/onsite roles in Austin, TX or Boxborough, MA, with tasks including test planning, defect triaging, and automation. Requires MS in CS/CE/Electrical Engineering, programming skills (Python, C++), and Linux/Windows experience. No visa sponsorship.”
“AMD offers a 6-month ASIC Package Engineering internship (Jan-Aug 2027) in Austin, TX or Boxborough, MA. Hybrid/onsite role for undergrads in EE/related fields, focusing on package design, yield analysis, and material benchmarking. No visa sponsorship.”
“AMD offers a 5-month internship in Singapore for AI-driven BOM automation using LLMs, RAG, and AI agents. Candidates must be Singapore-based students with Python/SQL skills. Project involves developing AI solutions for semiconductor product data management with cross-functional teams.”
“AMD offers a 5-month (Jan-May 2027, optional extension to Aug 2027) internship in Singapore for mechanical/thermal hardware development. Role involves ATE testing hardware, CAD design, and Python/JavaScript programming. Open to Singapore-based university students with relevant engineering backgrounds.”
“AMD offers a 5-month internship in Singapore (Jan-May 2027, optional extension to Aug 2027) for AI-intrinsic CPU/GPU product development. Focus on AI/ML models, MLOps, and full-stack solutions. Open to Singapore-based university students in CS, AI, or related fields. Basic Python/SQL required; advanced skills in CI/CD, Kubernetes, and LLM frameworks are a plus.”
“AMD offers a 7-month ASIC Package Engineering internship (Jan-Aug 2027 or May-Dec 2027) in hybrid/onsite roles at Austin, TX, Boxborough, MA, or other US locations. Candidates must be US-based Masters students in EE/CE/ME/MS/related fields with skills in PCB design, scripting (Python/Perl), and semiconductor packaging. Visa sponsorship not available.”
“AMD offers a 7-month Product Development Engineering internship (Jan-Aug 2027 or May-Dec 2027) in hybrid/onsite roles across multiple US locations. Ideal for undergrad CS/EE students with skills in C++, Linux, scripting, and hardware debugging. Involves yield analysis, test program development, and product characterization for next-gen microprocessors.”
“AMD offers a 7-month (Jan-Aug or May-Dec 2027) Firmware Engineering internship/co-op in hybrid/onsite roles across multiple US locations. Ideal for Master's students in EE/CS/CE with C/C++ and embedded firmware experience. Work on x86 firmware, bootrom, and HW/FW debugging. No compensation details provided.”
“AMD offers a 7-month Firmware Engineering internship (Jan-Aug or May-Dec 2027) in hybrid/onsite roles across the US. Work on low-level C/C++ firmware development, embedded systems, and hardware debugging for AMD products. Ideal for US-based EE/CS/CE undergrads with relevant skills. Visa sponsorship not eligible.”
“AMD offers a 7-month Firmware Engineering internship (Jan-Aug or May-Dec 2027) in San Jose/Santa Clara, CA. Hybrid/onsite role for undergrads in EE/CS/CE. Work on x86 firmware, embedded systems, and hardware debugging with C/C++. No visa sponsorship.”
“AMD offers a 7-month Hardware Design Verification Engineering internship/co-op starting Jan 2027 or May/Jun 2027 in multiple US locations. Hybrid/onsite role for students in EE/CE programs with skills in Verilog, SystemVerilog, Python, C++, and hardware debugging. No visa sponsorship.”
“AMD offers a 7-month Software Engineer Internship/Co-op (Jan-Aug 2027 or May-Dec 2027) in hybrid/onsite roles across US locations. Ideal for undergrad CS/CE/EE students with C/C++, Python, Linux, and cloud/Azure skills. Gain hands-on experience in software development, debugging, and automation under expert mentorship.”
“AMD offers a 7-month Hardware Engineering internship (Jan-Aug 2027 or May-Dec 2027) in hybrid/onsite roles across multiple US locations. Ideal for US undergrad Electrical/Computer Engineering students with skills in C/C++, Python, ASIC design, or AI. Gain hands-on experience in hardware development and validation.”
“AMD offers a 7-month Hardware Design Verification Engineering internship (Jan-Aug or May-Dec 2027) in hybrid/onsite roles across multiple US locations. Focus on AI hardware, Verilog/SystemVerilog, Python/Perl scripting, and system-level testing. Open to US undergrads in EE/CE with relevant skills. Visa sponsorship not available.”
“AMD offers a 7-month Hardware Engineering internship/co-op starting Jan 2027 or May/Jun 2027 in US locations (Austin, TX, etc.). Hybrid/onsite role for Master's students in Electrical/Computer Engineering with skills in C/C++, Verilog, Python, ASIC design, AI, and hardware validation. No visa sponsorship.”
“AMD offers a 7-month (Jan-Aug 2027) hybrid/onsite ML/AI internship for US undergrads in CS, engineering, or data science. Work on AI algorithms, computer vision, and cloud-based projects with AMD engineers. No visa sponsorship. Competitive benefits included.”
“AMD offers a 7-month Hardware Design Verification Engineering internship/co-op in San Jose or Santa Clara, CA. The role involves collaboration with senior engineers, scripting in Perl/Python, Verilog/System Verilog coding, and hardware/software testing. Ideal for Master's students in Electrical/Computer Engineering with relevant technical skills.”
“AMD offers a 7-month Hardware Design Verification Engineering internship (Jan-Aug or May-Dec 2027) in San Jose or Santa Clara, CA. Hybrid/onsite role for undergrads in EE/CE, focusing on Verilog, SystemVerilog, Python, and hardware testing. No compensation details provided.”
“AMD offers a 7-month Product Development Engineering internship/co-op (Jan-Aug or May-Dec 2027) in San Jose or Santa Clara, CA. Hybrid/onsite role for undergrads in CS/CE/EE, focusing on microprocessor testing, debugging, and yield analysis. Technical skills in C++, Linux, scripting, and hardware debugging preferred.”
“PhD Research Engineering Internship at AMD (Jan-Aug 2027 or May-Dec 2027) for US-based PhD students in CS/EE. Hybrid/onsite in multiple US locations. Focus on hardware/software tech for next-gen computing, FPGA/ASIC design, ML frameworks, and distributed systems. No visa sponsorship.”
“AMD offers a 7-month (Jan-Aug 2027) Data Analyst internship/co-op in hybrid/onsite roles across multiple US locations. Candidates must be US undergrads in data/engineering fields with Python, SQL, or related skills. Tasks include data analysis, visualization, and modeling. Visa sponsorship not available.”
“AMD offers a 12-week Summer 2027 internship for Master's students in Computer/Electrical Engineering. Hybrid/onsite role in San Jose, CA, focusing on FPGA, x86, and AI technologies. Gain hands-on experience with digital design, CPU architecture, and technical demos. No visa sponsorship available.”
“AMD offers a 7-month Machine Learning/AI internship (Jan-Aug or May-Dec 2027) in hybrid/onsite roles across multiple US locations. Ideal for Master's students in CS/engineering with Python/C++ skills. Work on AI/ML projects like computer vision and deep learning frameworks (PyTorch/TensorFlow). Visa sponsorship not available.”
“AMD offers a 12-week Summer 2027 Finance Internship in Austin, TX (hybrid/onsite). Ideal for US undergrads in finance/accounting/business/data science, focusing on process improvement, financial analysis, and cross-functional collaboration. No visa sponsorship.”
