Engineering Internships in Fort Collins, USA

“(COMPANY NAME) offers a 2027 Masters Compiler Engineering Internship/Co-op in Austin, TX, Boxborough, MA, or other US locations. Hybrid/onsite role for 40h/week, focusing on compiler development for P4 language using LLVM/P4C. Open to Master's students in CS/CE/EE with C++ and compiler experience. No visa sponsorship.”

“(COMPANY NAME) offers a 6-month ASIC Package Engineering internship (Jan-Aug 2027) in Austin, TX or Boxborough, MA. Hybrid/onsite role for undergrads in EE/related fields, focusing on package design, yield analysis, and material benchmarking. No visa sponsorship.”

“(COMPANY NAME) offers a 7-month ASIC Package Engineering internship (Jan-Aug 2027 or May-Dec 2027) in hybrid/onsite roles at Austin, TX, Boxborough, MA, or other US locations. Candidates must be US-based Masters students in EE/CE/ME/MS/related fields with skills in PCB design, scripting (Python/Perl), and semiconductor packaging. Visa sponsorship not available.”

“(COMPANY NAME) Solutions (HPS) offers a 12-week paid summer internship (2027) for engineering/technical students. $29-$35/hour, full-time, US-based roles with benefits (health, dental, parental leave). Focus on areas like software, hardware, cybersecurity, and data science. No visa sponsorship for full-time conversion.”

“(COMPANY NAME) offers a 7-month Product Development Engineering internship (Jan-Aug 2027 or May-Dec 2027) in hybrid/onsite roles across multiple US locations. Ideal for undergrad CS/EE students with skills in C++, Linux, scripting, and hardware debugging. Involves yield analysis, test program development, and product characterization for next-gen microprocessors.”

“(COMPANY NAME) offers a 7-month (Jan-Aug or May-Dec 2027) Firmware Engineering internship/co-op in hybrid/onsite roles across multiple US locations. Ideal for Master's students in EE/CS/CE with C/C++ and embedded firmware experience. Work on x86 firmware, bootrom, and HW/FW debugging. No compensation details provided.”

“(COMPANY NAME) offers a 7-month Firmware Engineering internship (Jan-Aug or May-Dec 2027) in hybrid/onsite roles across the US. Work on low-level C/C++ firmware development, embedded systems, and hardware debugging for (COMPANY NAME) products. Ideal for US-based EE/CS/CE undergrads with relevant skills. Visa sponsorship not eligible.”

“(COMPANY NAME) offers a 7-month Hardware Design Verification Engineering internship (Jan-Aug or May-Dec 2027) in hybrid/onsite roles across multiple US locations. Focus on AI hardware, Verilog/SystemVerilog, Python/Perl scripting, and system-level testing. Open to US undergrads in EE/CE with relevant skills. Visa sponsorship not available.”