Summer Internship Program 2026 - Systems Analyst, Release Engineering Intern

Descripción del puesto:

Overview

Job Purpose
The ICE Internship Program offers a dynamic opportunity to combine hands-on, impactful work on projects that shape our business, alongside practical career and professional development. You'll build meaningful connections, strengthen your interpersonal skills, and contribute in ways that truly make a difference.

Beyond your day-to-day responsibilities, you'll participate in weekly sessions led by industry leaders, connect with fellow interns, and deepen your understanding of the financial services, technology, and mortgage industries.

The Systems Analyst, Release Engineering Intern will handle user and configuration management requests within the Release Engineering domain.

Responsibilities
* Support the adoption and integration of GitHub Cloud within Release Engineering workflows
* Administer Jira projects, including user access, configuration, and issue tracking setup
* Manage and maintain Artifactory repositories to ensure efficient build and release processes
* Perform additional duties and contribute to projects as assigned
Knowledge and Experience
* Must be currently enrolled in a degree program at an accredited university and be at least advancing to their junior year of study
* Familiarity with common Software Development Life Cycle (SDLC) tools
* Experience or coursework in scripting technologies
* Demonstrates strong written and oral communication skills
Internship Program Schedule
To accommodate varying academic calendars, the ICE Internship Program offers two schedule options:
* Option 1: May 18, 2026 - August 7, 2026
* Option 2: June 8, 2026 - August 21, 2026
Candidates will be asked to select their preferred session during the application process.

Please Note: Interns must be available to work full-time, five days a week, at our Atlanta office for the entire duration of one of the designated program schedules. Partial participation or alternate dates cannot be accommodated.

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