Academic Internship in Materials Engineering, Mechanical Engineering, Physical Engineering, Polymer Engineering or Chemistry (f/m/div.)

Description du poste:

Job Description

Your contribution to something big:
- Topic: Investigation of Cu-pillar Underfill for Semiconductor Applications.
* State-of-the-art Review of Underfill in the semiconductor industry;
* Identification of relevant material properties and influence on reliability;
* Material Characterization (Thermal analysis, Rheology, Chemical analysis, DMA and TMA);
* Shear/adhesion strength method implementation in Bosch BrgP;
* Definition of test method for Nano-identation measurements in Bosch BrgP.

These tasks are planeed to be conducted collaboratively, both within Bosch BrgP's laboratory and production environments, and at University of Minho for further testing (e.g., DMA, TMA)

Profil requis du candidat:

Qualifications

What distinguishes you:
- Knowledge in materials characterization techniques, chemical analysis and material science;
- Knowledge in testing and statistical methods;
- Prefered high knowledge in Materials Engeneering and mechanical;
- Proficiency with Microsoft Office tools;
- Experience in lab environment (mandatory);
- Good written and verbal communication skills in English (mandatory);
- Team working and colaboration ability;
- Adaptability and Flexibility;
- Critical thinking and problem solving skills;
- Communicative, responsible and time management/organization skills