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Descrizione del lavoro:
Competitive Analysis Intern - Package Innovation
Role Summary
Support the Package Innovation (PI) team in building competitive intelligence through structured analysis of semiconductor packaging technologies, market trends, and competitor activities.
Key Responsibilities
* Perform structured data mining of competitor product releases, PCNs, teardown reports, and technology announcements
* Develop insights on packaging trends, cost/performance positioning, and technology differentiation
* Conduct startup and emerging technology evaluations relevant to advanced packaging
* Consolidate findings into clear, executive-ready reports and dashboards for PI leadership
* Maintain and enhance competitive analysis databases and tracking frameworks
Additional Exposure
* Participate in ATKL manufacturing projects to gain foundational understanding of semiconductor assembly processes
Qualifications
* Degree candidate in Materials Science, Mechanical, Electrical Engineering, or related field
* Strong analytical mindset with ability to synthesize large datasets into actionable insights
* Proficient in Excel and PowerPoint; data analysis or visualization experience preferred
* Familiarity with AI tools and advanced search techniques for efficient data mining is highly desired
* Strong communication skills with ability to clearly present findings
More information about NXP in Malaysia...
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| Provenienza: | Web dell'azienda |
|---|---|
| Pubblicato il: | 26 Set 2026 (verificato il 01 Ott 2026) |
| Tipo di impiego: | Stage |
| Lingue: | Inglese |