BEST Scholarship Program - 2026

Descrizione del lavoro:

Job Description

The BEST Scholarship Program provides the opportunity for master students - primarily in engineering fields - to pursue their studies at the highest level.
During the program's duration (1.5-2 years), students can not only apply and expand their academic knowledge in the corporate world, but can also gain in-depth professional experience and dive into an interesting research topic with the support of a dedicated mentor.
Your responsibilities:
► Ongoing Master's studies with a minimum of 4.00 cumulative GPA/semester
► Intention to start PhD studies later on
► Writing your thesis work about your Bosch research topic
► Participation at the TDK conference with your Bosch research topic
► Regular consultation with your Bosch mentor
►Participating at professional events
► Completing your mandatory internship at the company
► Developing your skills based on a specific training plan

Requisiti del candidato:

Qualifications

What scholarship offers you:
► Outstanding scholarship (gross 350 000 HUF/month)
► Dedicated mentor
► Corporate laptop
► Opportunity to participate at different trainings, conferences and courses
► Personal and professional development
► Opportunity to build a valuable connection network
► Support your TDK work with necessary resources

Application information:
Start date of the program: November 2026
Duration of the program: maximum 2 years

Application components: English CV, Motivation letter, letter of recommendation (preferably from university professor/professors)
Please indicate in your motivation letter, in which category/categories you would be interested in that are listed below, as well as add to your motivation letter, which topic/topics you would be interested in from our 2026 topic list (can be found on our Bosch site under the BEST Program's page):
Mechatronics, Embedded system, IT, Artificial intelligence, Material science, Mechanical design, Measurement technology, Data management, SW design, SW testing, Signal processing, Machine vision, Sensor fusion, Others.
Application deadline: 7 September 2026.
For further inquiries, please contact: [email protected]