“AMD offers a Hardware Design Engineering internship/co-op in Markham, Canada, for 4-8 months starting Jan, May, or Sep 2027. Work on ASIC design, RTL, Verilog, UVM, and chip interconnects. Requires enrollment in a Canadian EE/CE Bachelor's program. Hybrid/onsite role.”
“AMD offers a 7-month Software Test Engineering internship/co-op (Jan-Aug or May-Dec 2027) in San Jose or Santa Clara, CA. Hybrid/onsite role for undergrads in CS/CE/EE with QA, testing, and scripting skills. Gain hands-on experience in automated/manual testing, defect triaging, and collaboration with development teams.”
“AMD offers a 7-month Software Test Engineering internship/co-op starting in Jan 2027 or May/June 2027. Hybrid/onsite roles in Austin, TX or Boxborough, MA, with tasks including test planning, defect triaging, and automation. Requires MS in CS/CE/Electrical Engineering, programming skills (Python, C++), and Linux/Windows experience. No visa sponsorship.”
“AMD offers a 6-month ASIC Package Engineering internship (Jan-Aug 2027) in Austin, TX or Boxborough, MA. Hybrid/onsite role for undergrads in EE/related fields, focusing on package design, yield analysis, and material benchmarking. No visa sponsorship.”
“AMD offers a 5-month internship in Singapore for AI-driven BOM automation using LLMs, RAG, and AI agents. Candidates must be Singapore-based students with Python/SQL skills. Project involves developing AI solutions for semiconductor product data management with cross-functional teams.”
“AMD offers a 5-month (Jan-May 2027, optional extension to Aug 2027) internship in Singapore for mechanical/thermal hardware development. Role involves ATE testing hardware, CAD design, and Python/JavaScript programming. Open to Singapore-based university students with relevant engineering backgrounds.”
“AMD offers a 5-month internship in Singapore (Jan-May 2027, optional extension to Aug 2027) for AI-intrinsic CPU/GPU product development. Focus on AI/ML models, MLOps, and full-stack solutions. Open to Singapore-based university students in CS, AI, or related fields. Basic Python/SQL required; advanced skills in CI/CD, Kubernetes, and LLM frameworks are a plus.”
“AMD offers a 7-month ASIC Package Engineering internship (Jan-Aug 2027 or May-Dec 2027) in hybrid/onsite roles at Austin, TX, Boxborough, MA, or other US locations. Candidates must be US-based Masters students in EE/CE/ME/MS/related fields with skills in PCB design, scripting (Python/Perl), and semiconductor packaging. Visa sponsorship not available.”
“AMD offers a 7-month Product Development Engineering internship (Jan-Aug 2027 or May-Dec 2027) in hybrid/onsite roles across multiple US locations. Ideal for undergrad CS/EE students with skills in C++, Linux, scripting, and hardware debugging. Involves yield analysis, test program development, and product characterization for next-gen microprocessors.”
“AMD offers a 7-month (Jan-Aug or May-Dec 2027) Firmware Engineering internship/co-op in hybrid/onsite roles across multiple US locations. Ideal for Master's students in EE/CS/CE with C/C++ and embedded firmware experience. Work on x86 firmware, bootrom, and HW/FW debugging. No compensation details provided.”
“AMD offers a 7-month Firmware Engineering internship (Jan-Aug or May-Dec 2027) in hybrid/onsite roles across the US. Work on low-level C/C++ firmware development, embedded systems, and hardware debugging for AMD products. Ideal for US-based EE/CS/CE undergrads with relevant skills. Visa sponsorship not eligible.”
“AMD offers a 7-month Firmware Engineering internship (Jan-Aug or May-Dec 2027) in San Jose/Santa Clara, CA. Hybrid/onsite role for undergrads in EE/CS/CE. Work on x86 firmware, embedded systems, and hardware debugging with C/C++. No visa sponsorship.”
“AMD offers a 7-month Hardware Design Verification Engineering internship/co-op starting Jan 2027 or May/Jun 2027 in multiple US locations. Hybrid/onsite role for students in EE/CE programs with skills in Verilog, SystemVerilog, Python, C++, and hardware debugging. No visa sponsorship.”
“AMD offers a 7-month Software Engineer Internship/Co-op (Jan-Aug 2027 or May-Dec 2027) in hybrid/onsite roles across US locations. Ideal for undergrad CS/CE/EE students with C/C++, Python, Linux, and cloud/Azure skills. Gain hands-on experience in software development, debugging, and automation under expert mentorship.”
“AMD offers a 7-month Hardware Engineering internship (Jan-Aug 2027 or May-Dec 2027) in hybrid/onsite roles across multiple US locations. Ideal for US undergrad Electrical/Computer Engineering students with skills in C/C++, Python, ASIC design, or AI. Gain hands-on experience in hardware development and validation.”
“AMD offers a 7-month Hardware Design Verification Engineering internship (Jan-Aug or May-Dec 2027) in hybrid/onsite roles across multiple US locations. Focus on AI hardware, Verilog/SystemVerilog, Python/Perl scripting, and system-level testing. Open to US undergrads in EE/CE with relevant skills. Visa sponsorship not available.”
“AMD offers a 7-month Hardware Engineering internship/co-op starting Jan 2027 or May/Jun 2027 in US locations (Austin, TX, etc.). Hybrid/onsite role for Master's students in Electrical/Computer Engineering with skills in C/C++, Verilog, Python, ASIC design, AI, and hardware validation. No visa sponsorship.”
“AMD offers a 7-month (Jan-Aug 2027) hybrid/onsite ML/AI internship for US undergrads in CS, engineering, or data science. Work on AI algorithms, computer vision, and cloud-based projects with AMD engineers. No visa sponsorship. Competitive benefits included.”
“AMD offers a 7-month Hardware Design Verification Engineering internship/co-op in San Jose or Santa Clara, CA. The role involves collaboration with senior engineers, scripting in Perl/Python, Verilog/System Verilog coding, and hardware/software testing. Ideal for Master's students in Electrical/Computer Engineering with relevant technical skills.”
“AMD offers a 7-month Hardware Design Verification Engineering internship (Jan-Aug or May-Dec 2027) in San Jose or Santa Clara, CA. Hybrid/onsite role for undergrads in EE/CE, focusing on Verilog, SystemVerilog, Python, and hardware testing. No compensation details provided.”
“AMD offers a 7-month Product Development Engineering internship/co-op (Jan-Aug or May-Dec 2027) in San Jose or Santa Clara, CA. Hybrid/onsite role for undergrads in CS/CE/EE, focusing on microprocessor testing, debugging, and yield analysis. Technical skills in C++, Linux, scripting, and hardware debugging preferred.”
“AMD offers a 7-month (Jan-Aug 2027) Data Analyst internship/co-op in hybrid/onsite roles across multiple US locations. Candidates must be US undergrads in data/engineering fields with Python, SQL, or related skills. Tasks include data analysis, visualization, and modeling. Visa sponsorship not available.”
“AMD offers a 12-week Summer 2027 internship for Master's students in Computer/Electrical Engineering. Hybrid/onsite role in San Jose, CA, focusing on FPGA, x86, and AI technologies. Gain hands-on experience with digital design, CPU architecture, and technical demos. No visa sponsorship available.”
“AMD offers a 7-month Machine Learning/AI internship (Jan-Aug or May-Dec 2027) in hybrid/onsite roles across multiple US locations. Ideal for Master's students in CS/engineering with Python/C++ skills. Work on AI/ML projects like computer vision and deep learning frameworks (PyTorch/TensorFlow). Visa sponsorship not available.”
“AMD offers a 12-week Summer 2027 Finance Internship in Austin, TX (hybrid/onsite). Ideal for US undergrads in finance/accounting/business/data science, focusing on process improvement, financial analysis, and cross-functional collaboration. No visa sponsorship.”
“AMD offers a 7-month Firmware Engineering internship/co-op (Jan-Aug or May-Dec 2027) in San Jose/ Santa Clara, CA. Hybrid/onsite role for Master's students in EE/CS/CE. Work on x86 firmware, embedded systems, and hardware debugging with C/C++. Gain experience in AGILE, Linux, and hardware design tools.”
“AMD offers a 7-month Software Engineer internship/co-op starting in 2027 for Master's students in Computer Science or related fields. Based in multiple US locations (onsite/hybrid), it involves software development, debugging, and cloud computing with training and mentorship. No compensation details provided.”
“AMD offers a 12-week Summer 2027 Finance Internship in Austin, TX (hybrid/onsite). Ideal for Master's students in finance/accounting/business. Focus on process improvement, financial analysis, and cross-functional collaboration. No visa sponsorship available.”
“AMD offers a 7-month Data Analyst internship/co-op (Jan-Aug 2027) in hybrid/onsite roles across the US for Master's students in Data Analytics, CS, or related fields. Work involves data analysis, visualization, modeling, and reporting with tools like Python, SQL, Tableau, and Azure. Visa sponsorship not available.”
“AMD offers a 7-month internship in Singapore for students in Electrical/Computer Engineering. Role involves designing diagnostics tests for processors, debugging HW/SW issues, and working with C++ in Linux. Includes mentorship, networking, and potential extension. Requires school placement letter.”
“AMD offers a 7-month IC Design Exploration internship in Singapore starting May or July 2026. Focus areas include analog/digital design, verification, and post-silicon validation. Ideal for electronics/computer engineering students with scripting skills. No compensation details provided.”
“AMD offers a 4-month internship in Singapore (Jan-May 2026, optional extension to Jul 2026) for students. Role involves test development, automation tools, and system-on-chip qualification for next-gen server processors using C++, Python, and Agile methods. Ideal for electronics/computer engineering students seeking hands-on experience in a collaborative tech environment.”
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