QUALCOMM | Shanghai
| Praktikum, Ingenieurswesen, Englisch
“Internship (3 months) at Qualcomm China for Physical Design Engineer role. Tasks include synthesis/DFT logic insertion, ATPG pattern generation, physical design from Verilog to GDS, floorplan, placement, CTS, routing, timing/SI/IR-drop analysis, and signoff. Requires VLSI flow knowledge, Linux scripting, and English proficiency. Nice-to-have: SCAN/MBIST insertion, ICC2/INN/ICC/PT tools, timing closure, and semiconductor process familiarity.”