Thermal Intern

Job Description:

Huawei Technologies is a leading global provider of information and communications technology (ICT) infrastructure and smart devices. Our Thermal Management Group in the Helsinki Hardware and System Lab (HHSL) at the Huawei Finland Research Center serves as a hub for developing innovative solutions to address the challenges of electronic cooling in advanced devices.

We are an R&D-focused team exploring advanced materials and device concepts for next-generation applications. Our work covers materials processing, device integration, and experimental characterization. We are looking for a motivated intern eager to contribute to innovative research in a highly collaborative and international environment.

Role Overview

The intern will work on projects involving materials design, device prototyping, and advanced characterization methods. The position will include hands-on experimental work, data analysis, and reporting, as well as opportunities to interact with a multidisciplinary team of researchers.

Key Responsibilities

* Contribute to thermal design and analysis of electronic devices and systems
* Assist in materials preparation, processing, and encapsulation experiments
* Operate and analyze results from thermal and mechanical characterization equipment (e.g., DSC, DMA)
* Support design, fabrication, and performance evaluation of experimental prototypes
* Conduct data analysis, literature reviews, and technical documentation
* Collaborate with team members to support ongoing project milestones and internal presentations

Qualifications

* Currently pursuing a Master/PhD in Materials Science, Chemistry, Chemical Engineering, or a related field
* Experience with materials encapsulation techniques is desirable
* Knowledge of thermal and mass transport principles is required
* Hands-on experience with analytical tools (DSC, DMA, TGA, etc.)
* Strong problem-solving ability, capable of working both independently and in a team setting
* Excellent written and verbal communication skills in English; Chinese language skills are a strong plus

Internship Period: 4-6 months, starting from December, 2025

Location: Helsinki, Finland

Company Benefits:

* Competitive salary commensurate with qualifications and experience.
* Dynamic and collaborative work environment with opportunities for professional growth and development.
* Access to state-of-the-art research facilities and resources.
* Networking opportunities with industry experts and researchers in the field of electronics and next generation technology development.

To apply for this position, please submit your resume, a cover letter outlining your qualifications and research interests, and any relevant publications or academic references