Graduate Programmes at Intel

“Join Intel as a Packaging Module Development Engineer to work on advanced machine vision and machine learning applications for semiconductor packaging. Responsibilities include package design, thermal/mechanical/electrical analysis, and project management. Minimum qualifications include a Bachelor's or Master's degree in Engineering, Physics, or Computer Science with relevant experience in optics and imaging techniques. Preferred qualifications include semiconductor inspection, data science tools like Python, and machine vision techniques. The role is based in Phoenix, Arizona, with an annual salary range of $85,200 to $139,810 USD.”

“Packaging Module Development Engineer at Intel's APTM division. Develop FLI/SLI and thermal solutions, collaborate with cross-functional teams, innovate materials and processes. PhD required in related fields. Onsite role in Phoenix, AZ. Salary range: $133,800-$188,890 USD.”

“Intel is seeking a Server Platform Validation and Debug Engineer for their Data Center Group in Guadalajara, Mexico. The role involves validating server platforms, debugging issues, and collaborating with cross-functional teams. Candidates should have a Bachelor's degree in Engineering, 1+ years of experience in system design and validation, and advanced English skills. The position is for a College Grad and offers a hybrid work model.”

“* Activities include problem analysis and methodology definition, followed by design, implementation, test, de...”

“"Intel is committed to Responsible Business Alliance (RBA) compliance and ethical hiring practices. ...”

“* Understanding silicon parametric across distributions (Vmins, Cdyn, leakage, transistor performance, Basic o...”