Graduate Programmes in Phoenix, USA

“Join (COMPANY NAME) as a Packaging Module Development Engineer to work on advanced machine vision and machine learning applications for semiconductor packaging. Responsibilities include package design, thermal/mechanical/electrical analysis, and project management. Minimum qualifications include a Bachelor's or Master's degree in Engineering, Physics, or Computer Science with relevant experience in optics and imaging techniques. Preferred qualifications include semiconductor inspection, data science tools like Python, and machine vision techniques. The role is based in Phoenix, Arizona, with an annual salary range of $85,200 to $139,810 USD.”

“Packaging Module Development Engineer at (COMPANY NAME)'s APTM division. Develop FLI/SLI and thermal solutions, collaborate with cross-functional teams, innovate materials and processes. PhD required in related fields. Onsite role in Phoenix, AZ. Salary range: $133,800-$188,890 USD.”

“Nurture your curiosity and a commitment to customers' well-being in our Risk Engineering program. ...”