PACKAGING ENGINEER H/F

Descrizione del lavoro:

Chez Capgemini Engineering, leader mondial des services d'ingénierie, nous rassemblons des équipes composées d'ingénieurs, de scientifiques et d'architectes pour soutenir les entreprises les plus innovantes dans l'exploitation de leurs potentiels . Que ce soit dans le domaine des voitures autonomes ou des robots qui sauvent des vies, nos experts en technologies numériques et logicielles se démarquent en offrant des services distinctifs de R&D et d'ingénierie dans tous les secteurs. Rejoignez-nous pour une carrière pleine d'opportunités, où vous pouvez vraiment faire la différence, dans un environnement où chaque jour est unique. Get The Future You Want | www.capgemini.com/fr fr
At Capgemini Engineering, the world leader in engineering services, we bring together a global team of engineers, scientists, and architects to help the world's most innovative companies unleash their potential. From autonomous cars to life-saving robots, our digital and software technology experts think outside the box as they provide unique R&D and engineering services across all industries. Join us for a career full of opportunities. Where you can make a difference. Where no two days are the same. Mission Define the package type in collaboration with customers and sub-contractors. Provide technical support and act as an intermediary between customers and sub-contractors to address and resolve packaging-related issues. Lead the development of modules, MCM (Multi-Chip Modules), and substrates for new types of packages in partnership with our sub-contractors. Coordinate package design, as well as electrical and thermal characterization and manufacturability assessments. Ensure that the package development process, from conceptual design and feasibility studies to substrate fabrication, is completed on time and meets cost and quality requirements (signal integrity, thermal performance, manufacturability, bondability, DfX, etc.). Discuss potential yield and/or reliability issues, conduct failure analysis, and drive process improvements to enhance packaging operations

Requisiti del candidato:

A master's degree in Electronics Engineering. Candidates with a bachelor's degree and several years of relevant experience will also be considered. Experience with SoC devices and various IC-packaging methods. Proven experience in project-based work, with the ability to manage multiple tasks and deadlines. Pro-active, customer-focused, and highly motivated to work within a team of engineers. Fluent in English with excellent communication skills. Willingness to travel regularly to sub-contractors' sites